Junior Photonic Packaging Engineer

Hace 7 horas

castelldefels, kingdom of spain BIST People Working Group Jornada completa

ICFO is seeking a Junior Process Engineer in PIC Packaging to support the development of assembly and interconnect technologies for Photonic Integrated Circuits (PICs).
La siguiente información tiene como objetivo proporcionar a los posibles candidatos una mejor comprensión de los requisitos para este puesto.
The selected candidate will work in an advanced R&D pilot-line environment, developing processes and solving engineering challenges. xhfqzwm

You will collaborate with multidisciplinary teams to implement scalable packaging solutions and advance PIC technologies from design to testing and applications.