Junior Photonic Packaging Engineer

Hace 1 día

Castelldefels, Cataluña, España BIST People Working Group Jornada completa

ICFO is seeking a Junior Process Engineer in PIC Packaging to support the development of assembly and interconnect technologies for Photonic Integrated Circuits (PICs).

La siguiente información tiene como objetivo proporcionar a los posibles candidatos una mejor comprensión de los requisitos para este puesto.

The selected candidate will work in an advanced R&D pilot-line environment, developing processes and solving engineering challenges. xghoner

You will collaborate with multidisciplinary teams to implement scalable packaging solutions and advance PIC technologies from design to testing and applications.