Junior Photonic Packaging Engineer

Hace 5 días

Barcelona, España Bist People Working Group Jornada completa

ICFO is seeking a Junior Process Engineer in PIC Packaging to support the development of assembly and interconnect technologies for Photonic Integrated Circuits (PICs).
La siguiente información tiene como objetivo proporcionar a los posibles candidatos una mejor comprensión de los requisitos para este puesto.The selected candidate will work in an advanced R&D pilot-line environment, developing processes and solving engineering challenges.
xqbhyrx You will collaborate with multidisciplinary teams to implement scalable packaging solutions and advance PIC technologies from design to testing and applications.
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