High-Performance Gan-Based Hemts
hace 1 mes
Puesto: High-performance GaN-based HEMTs Función: Design, modelling, and fabrication of high-performance GaN-based HEMTs: Development of nanocale devices by E-Beam Lithography (EBL) and Thermal Scanning Probe Lithography (t-SPL) in normally-on and normally-off HEMT structures... Master Idiomas TAREAS/TASKS: Design, modelling, and fabrication of high-performance GaN-based HEMTs: • Development of nanocale devices by E-Beam Lithography (EBL) and Thermal Scanning Probe Lithography (t-SPL) in normally-on and normally-off HEMT structures • Exploration of the integration of 2D materials for enhanced HEMT performance HABILIDADES-CUALIFICACIONES/SKILLS-QUALIFICATIONS: • MS Office, Latex, Adobe Illustrator, AutoCAD • Previous experience on programming (Python, C, LabVIEW, etc) and scientific (Mathematica, Matlab, Origin, etc) or simulation (COMSOL, etc) software will be highly valued • Candidates must hold a Master Degree in Electronic/Telecommunication/Materials Engineering or Physics • Proficiency in English • Goal-oriented mindset, creativity, teamwork & communication skills • Previous research experience will be highly valued BENEFICIOS/BENEFITS: • The hired researcher will pursue an industrial PhD in a joint program with INDRA Sistemas S. A., a Spanish multinational company, within the project "Chair UPM-INDRA in Microelectronics". • Health and social benefits according to Spanish law. CRITERIOS Y PROCESO DE SELECCION/ELIGIBILITY CRITERIA AND SELECTION PROCESS: Applicants should send a motivation letter & CV Jorge Pedrós (******) #J-18808-Ljbffr
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High-Performance Gan-Based Hemts
hace 3 días
Madrid, España Universidad Politécnica de Madrid Employees, Location, Alumni A tiempo completoPuesto: High-performance GaN-based HEMTs Función: Design, modelling, and fabrication of high-performance GaN-based HEMTs: Development of nanocale devices by E-Beam Lithography (EBL) and Thermal Scanning Probe Lithography (t-SPL) in normally-on and normally-off HEMT structures... Master Idiomas TAREAS/TASKS: Design, modelling, and fabrication of...
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High-Performance Gan-Based Hemts
hace 3 semanas
Madrid, España Universidad Politécnica de Madrid Employees, Location, Alumni A tiempo completoPuesto: High-performance GaN-based HEMTs Función: Design, modelling, and fabrication of high-performance GaN-based HEMTs: Development of nanocale devices by E-Beam Lithography (EBL) and Thermal Scanning Probe Lithography (t-SPL) in normally-on and normally-off HEMT structures...MasterIdiomasTAREAS/TASKS:Design, modelling, and fabrication of high-performance...
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High-Performance Gan-Based Hemts
hace 1 semana
Madrid, Madrid, España Universidad Politécnica de Madrid Employees, Location, Alumni A tiempo completoPuesto: High-performance GaN-based HEMTs Función: Design, modelling, and fabrication of high-performance GaN-based HEMTs: Development of nanocale devices by E-Beam Lithography (EBL) and Thermal Scanning Probe Lithography (t-SPL) in normally-on and normally-off HEMT structuresMaster Idiomas TAREAS/TASKS:Design, modelling, and fabrication of high-performance...
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High-Performance Gan-Based Hemts
hace 1 semana
Madrid, Madrid, España Universidad Politécnica de Madrid Employees, Location, Alumni A tiempo completoPuesto: High-performance GaN-based HEMTs Función: Design, modelling, and fabrication of high-performance GaN-based HEMTs: Development of nanocale devices by E-Beam Lithography (EBL) and Thermal Scanning Probe Lithography (t-SPL) in normally-on and normally-off HEMT structuresMasterIdiomasTAREAS/TASKS:Design, modelling, and fabrication of high-performance...
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High-Performance Gan-Based Hemts
hace 3 días
Madrid, España Universidad Politécnica De Madrid A tiempo completoFunción: Design, modelling, and fabrication of high-performance GaN-based HEMTs: Development of nanocale devices by E-Beam Lithography (EBL) and Thermal Scanning Probe Lithography (t-SPL) in normally-on and normally-off HEMT structures...- Empresa: UNIVERSIDAD POLITÉCNICA DE MADRID- Nº de Plazas: 1- Referencia: HRS2024/184- Publicada el 6/5/2024-...
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High-performance Gan-based Hemts
hace 2 meses
Madrid, España UNIVERSIDAD POLITÉCNICA DE MADRID A tiempo completoFunción: Design, modelling, and fabrication of high-performance GaN-based HEMTs: Development of nanocale devices by E-Beam Lithography (EBL) and Thermal Scanning Probe Lithography (t-SPL) in normally-on and normally-off HEMT structures... - Empresa: UNIVERSIDAD POLITÉCNICA DE MADRID - Nº de Plazas: 1 - Referencia: HRS2024/184 - Publicada el 6/5/2024 -...
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Advanced Packaging Of Gan-Based Hemts
hace 1 mes
Madrid, España Universidad Politécnica de Madrid Employees, Location, Alumni A tiempo completoPuesto: Advanced packaging of GaN-based HEMTs Función: Design, modelling, and fabrication of advanced packaging architectures for the System-in-Package (SiP) integration of GaN-based HEMTs: Optimization of various packaging architectures (wirebonding, embedded chip, and flip-chip) for high frequency and hig Master Idiomas TAREAS/TASKS: Design, modelling,...
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Advanced Packaging Of Gan-Based Hemts
hace 3 semanas
Madrid, España Universidad Politécnica de Madrid Employees, Location, Alumni A tiempo completoPuesto: Advanced packaging of GaN-based HEMTs Función: Design, modelling, and fabrication of advanced packaging architectures for the System-in-Package (SiP) integration of GaN-based HEMTs: Optimization of various packaging architectures (wirebonding, embedded chip, and flip-chip) for high frequency and hig Master Idiomas TAREAS/TASKS: Design, modelling,...
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Advanced Packaging Of Gan-Based Hemts
hace 3 días
Madrid, España Universidad Politécnica de Madrid Employees, Location, Alumni A tiempo completoPuesto: Advanced packaging of GaN-based HEMTs Función: Design, modelling, and fabrication of advanced packaging architectures for the System-in-Package (SiP) integration of GaN-based HEMTs: Optimization of various packaging architectures (wirebonding, embedded chip, and flip-chip) for high frequency and hig Master Idiomas TAREAS/TASKS: Design,...
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Advanced Packaging Of Gan-Based Hemts
hace 3 semanas
Madrid, España Universidad Politécnica de Madrid Employees, Location, Alumni A tiempo completoPuesto: Advanced packaging of GaN-based HEMTs Función: Design, modelling, and fabrication of advanced packaging architectures for the System-in-Package (SiP) integration of GaN-based HEMTs: Optimization of various packaging architectures (wirebonding, embedded chip, and flip-chip) for high frequency and higMasterIdiomasTAREAS/TASKS:Design, modelling, and...
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Advanced Packaging Of Gan-Based Hemts
hace 1 semana
Madrid, Madrid, España Universidad Politécnica de Madrid Employees, Location, Alumni A tiempo completoPuesto: Advanced packaging of GaN-based HEMTs Función: Design, modelling, and fabrication of advanced packaging architectures for the System-in-Package (SiP) integration of GaN-based HEMTs: Optimization of various packaging architectures (wirebonding, embedded chip, and flip-chip) for high frequency and hig Master Idiomas TAREAS/TASKS:Design, modelling, and...
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Advanced Packaging Of Gan-Based Hemts
hace 1 semana
Madrid, Madrid, España Universidad Politécnica de Madrid Employees, Location, Alumni A tiempo completoPuesto: Advanced packaging of GaN-based HEMTs Función: Design, modelling, and fabrication of advanced packaging architectures for the System-in-Package (SiP) integration of GaN-based HEMTs: Optimization of various packaging architectures (wirebonding, embedded chip, and flip-chip) for high frequency and higMasterIdiomasTAREAS/TASKS:Design, modelling, and...
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Advanced Packaging of Gan-based Hemts
hace 2 meses
Madrid, España UNIVERSIDAD POLITÉCNICA DE MADRID A tiempo completoFunción: Design, modelling, and fabrication of advanced packaging architectures for the System-in-Package (SiP) integration of GaN-based HEMTs: Optimization of various packaging architectures (wirebonding, embedded chip, and flip-chip) for high frequency and hig - Empresa: UNIVERSIDAD POLITÉCNICA DE MADRID - Nº de Plazas: 1 - Referencia: HRS2024/186 -...
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Advanced Packaging Of Gan-Based Hemts
hace 3 días
Madrid, España Universidad Politécnica De Madrid A tiempo completoFunción: Design, modelling, and fabrication of advanced packaging architectures for the System-in-Package (SiP) integration of GaN-based HEMTs: Optimization of various packaging architectures (wirebonding, embedded chip, and flip-chip) for high frequency and hig- Empresa: UNIVERSIDAD POLITÉCNICA DE MADRID- Nº de Plazas: 1- Referencia: HRS2024/186-...
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Hemt Integration with 2d Materials
hace 3 semanas
Madrid, España UNIVERSIDAD POLITÉCNICA DE MADRID A tiempo completoFunción: Integration of 2D materials with GaN-based high-electron mobility transistors (HEMTs) for advanced ICTs - Empresa: UNIVERSIDAD POLITÉCNICA DE MADRID - Nº de Plazas: 1 - Referencia: HRS2024/154 - Publicada el 8/4/2024 - Publicada hasta el 19/04/2024 - Tipo de Contrato: Contrato temporal - Dedicación: Jornada completa - Remuneración Bruta...
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Hemt Integration with 2d Materials
hace 4 semanas
Madrid, España UNIVERSIDAD POLITÉCNICA DE MADRID A tiempo completoFunción: Integration of 2D materials with GaN-based high-electron mobility transistors (HEMTs) for advanced ICTs - Empresa: UNIVERSIDAD POLITÉCNICA DE MADRID - Nº de Plazas: 1 - Referencia: HRS2024/154 - Publicada el 8/4/2024 - Publicada hasta el 19/04/2024 - Tipo de Contrato: Contrato temporal - Dedicación: Jornada completa - Remuneración Bruta...
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Solution Architect
hace 3 semanas
Madrid, España Genentech A tiempo completo**The Position**: We are looking for a highly motivated individual for the position of Solution Architect to join the High Performance Computing product. Someone who influences their own development pursues interests across functions and geographies and understands that a job title is not the final definition of who you are, but a starting point. You are a...
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Solution Architect
hace 4 semanas
Madrid, España Genentech A tiempo completo**The Position**: We are looking for a highly motivated individual for the position of Solution Architect to join the High Performance Computing product. Someone who influences their own development pursues interests across functions and geographies and understands that a job title is not the final definition of who you are, but a starting point. You are a...
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Accounts Payable con with High English
hace 2 semanas
Madrid, España Page Personnel España A tiempo completoContabilidad de proveedores y cuentas por pagar - Gestión de proveedores, pagos, ficheros y archivo de cartera a nível global - Asientos contables y ciclo completo del área de proveedores de uno o varios países - Trabajo con otras áreas y departamentos del SSC - Trabajo con SAP diariamente - Reporte de actividad y situación de pagos a proveedores -...
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Performance Marketer
hace 5 días
Madrid, España Atida | Mifarma A tiempo completoAtida is one of the largest pan-European online health and wellbeing groups. We are leading the way in the digital health landscape by creating a unique destination and ecosystem of products and services that caters to supporting people’s holistic wellbeing. Our online pharmacies and parapharmacies are consumers’ favorites across 9 markets already...