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Advanced Packaging Of Gan-Based Hemts
hace 1 semana
Puesto:
Advanced packaging of GaN-based HEMTs Función: Design, modelling, and fabrication of advanced packaging architectures for the System-in-Package (SiP) integration of GaN-based HEMTs: Optimization of various packaging architectures (wirebonding, embedded chip, and flip-chip) for high frequency and hig Master Idiomas TAREAS/
TASKS:
Design, modelling, and fabrication of advanced packaging architectures for the System-in-Package (SiP) integration of GaN-based HEMTs:
- Optimization of various packaging architectures (wirebonding, embedded chip, and flip-chip) for high frequency and high power operation
- Synthesis of high thermal conductivity AlN and AlScN layers
- Integration of AlN and AlScN as interposers and heat dissipation layers HABILIDADES-CUALIFICACIONES/SKILLS-
QUALIFICATIONS:
- MS Office, Latex, Adobe Illustrator, AutoCAD
- Previous experience on programming (Python, C, LabVIEW, etc) and scientific (Mathematica, Matlab, Origin, etc) or simulation (COMSOL, etc) software will be highly valued
- Candidates must hold a Master Degree in Electronic/Telecommunication/Materials Engineering or Physics
- Proficiency in English
- Goal-oriented mindset, creativity, teamwork & communication skills
- Previous research experience will be highly valued BENEFICIOS/
BENEFITS:
- The hired researcher will pursue an industrial PhD in a joint program with INDRA Sistemas S. A., a Spanish multinational company, within the project "Chair UPM-INDRA in Microelectronics".
- Health and social benefits according to Spanish law.
Applicants should send a motivation letter & CV to both Marta Clement (
) and Jorge Pedrós (
). #J-18808-Ljbffr
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Advanced Packaging Of Gan-Based Hemts
hace 1 semana
Madrid, Madrid, España Universidad Politécnica de Madrid Employees, Location, Alumni A tiempo completoPuesto: Advanced packaging of GaN-based HEMTs Función: Design, modelling, and fabrication of advanced packaging architectures for the System-in-Package (SiP) integration of GaN-based HEMTs: Optimization of various packaging architectures (wirebonding, embedded chip, and flip-chip) for high frequency and higMasterIdiomasTAREAS/TASKS:Design, modelling, and...
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High-Performance Gan-Based Hemts
hace 1 semana
Madrid, Madrid, España Universidad Politécnica de Madrid Employees, Location, Alumni A tiempo completoPuesto: High-performance GaN-based HEMTs Función: Design, modelling, and fabrication of high-performance GaN-based HEMTs: Development of nanocale devices by E-Beam Lithography (EBL) and Thermal Scanning Probe Lithography (t-SPL) in normally-on and normally-off HEMT structuresMaster Idiomas TAREAS/TASKS:Design, modelling, and fabrication of high-performance...
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Madrid, Madrid, España Universidad Politécnica de Madrid Employees, Location, Alumni A tiempo completoPuesto: High-performance GaN-based HEMTs Función: Design, modelling, and fabrication of high-performance GaN-based HEMTs: Development of nanocale devices by E-Beam Lithography (EBL) and Thermal Scanning Probe Lithography (t-SPL) in normally-on and normally-off HEMT structuresMasterIdiomasTAREAS/TASKS:Design, modelling, and fabrication of high-performance...
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