Advanced Packaging Of Gan-Based Hemts

hace 1 semana


Madrid, Madrid, España Universidad Politécnica de Madrid Employees, Location, Alumni A tiempo completo

Puesto:
Advanced packaging of GaN-based HEMTs Función: Design, modelling, and fabrication of advanced packaging architectures for the System-in-Package (SiP) integration of GaN-based HEMTs: Optimization of various packaging architectures (wirebonding, embedded chip, and flip-chip) for high frequency and hig Master Idiomas TAREAS/

TASKS:
Design, modelling, and fabrication of advanced packaging architectures for the System-in-Package (SiP) integration of GaN-based HEMTs:

  • Optimization of various packaging architectures (wirebonding, embedded chip, and flip-chip) for high frequency and high power operation
  • Synthesis of high thermal conductivity AlN and AlScN layers
  • Integration of AlN and AlScN as interposers and heat dissipation layers HABILIDADES-CUALIFICACIONES/SKILLS-

QUALIFICATIONS:

  • MS Office, Latex, Adobe Illustrator, AutoCAD
  • Previous experience on programming (Python, C, LabVIEW, etc) and scientific (Mathematica, Matlab, Origin, etc) or simulation (COMSOL, etc) software will be highly valued
  • Candidates must hold a Master Degree in Electronic/Telecommunication/Materials Engineering or Physics
  • Proficiency in English
  • Goal-oriented mindset, creativity, teamwork & communication skills
  • Previous research experience will be highly valued BENEFICIOS/

BENEFITS:

  • The hired researcher will pursue an industrial PhD in a joint program with INDRA Sistemas S. A., a Spanish multinational company, within the project "Chair UPM-INDRA in Microelectronics".
  • Health and social benefits according to Spanish law.
CRITERIOS Y PROCESO DE SELECCION/ELIGIBILITY CRITERIA AND SELECTION PROCESS:
Applicants should send a motivation letter & CV to both Marta Clement (
) and Jorge Pedrós (
). #J-18808-Ljbffr

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