Advanced Packaging Of Gan-Based Hemts
hace 2 semanas
Puesto: Advanced packaging of GaN-based HEMTs Función: Design, modelling, and fabrication of advanced packaging architectures for the System-in-Package (SiP) integration of GaN-based HEMTs: Optimization of various packaging architectures (wirebonding, embedded chip, and flip-chip) for high frequency and higMasterIdiomasTAREAS/TASKS:Design, modelling, and fabrication of advanced packaging architectures for the System-in-Package (SiP) integration of GaN-based HEMTs:Optimization of various packaging architectures (wirebonding, embedded chip, and flip-chip) for high frequency and high power operationSynthesis of high thermal conductivity AlN and AlScN layersIntegration of AlN and AlScN as interposers and heat dissipation layersHABILIDADES-CUALIFICACIONES/SKILLS-QUALIFICATIONS:MS Office, Latex, Adobe Illustrator, AutoCADPrevious experience on programming (Python, C, LabVIEW, etc) and scientific (Mathematica, Matlab, Origin, etc) or simulation (COMSOL, etc) software will be highly valuedCandidates must hold a Master Degree in Electronic/Telecommunication/Materials Engineering or PhysicsProficiency in EnglishGoal-oriented mindset, creativity, teamwork & communication skillsPrevious research experience will be highly valuedBENEFICIOS/BENEFITS:The hired researcher will pursue an industrial PhD in a joint program with INDRA Sistemas S. A., a Spanish multinational company, within the project "Chair UPM-INDRA in Microelectronics".Health and social benefits according to Spanish law.CRITERIOS Y PROCESO DE SELECCION/ELIGIBILITY CRITERIA AND SELECTION PROCESS:Applicants should send a motivation letter & CV to both Marta Clement (******) and Jorge Pedrós (******).#J-18808-Ljbffr
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Advanced Packaging Of Gan-Based Hemts
hace 4 semanas
Madrid, España Universidad Politécnica de Madrid Employees, Location, Alumni A tiempo completoPuesto: Advanced packaging of GaN-based HEMTs Función: Design, modelling, and fabrication of advanced packaging architectures for the System-in-Package (SiP) integration of GaN-based HEMTs: Optimization of various packaging architectures (wirebonding, embedded chip, and flip-chip) for high frequency and hig Master Idiomas TAREAS/TASKS: Design, modelling,...
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Advanced Packaging Of Gan-Based Hemts
hace 3 semanas
Madrid, España Universidad Politécnica de Madrid Employees, Location, Alumni A tiempo completoPuesto: Advanced packaging of GaN-based HEMTs Función: Design, modelling, and fabrication of advanced packaging architectures for the System-in-Package (SiP) integration of GaN-based HEMTs: Optimization of various packaging architectures (wirebonding, embedded chip, and flip-chip) for high frequency and hig Master Idiomas TAREAS/TASKS: Design, modelling,...
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Advanced Packaging Of Gan-Based Hemts
hace 6 horas
Madrid, España Universidad Politécnica de Madrid Employees, Location, Alumni A tiempo completoPuesto: Advanced packaging of GaN-based HEMTs Función: Design, modelling, and fabrication of advanced packaging architectures for the System-in-Package (SiP) integration of GaN-based HEMTs: Optimization of various packaging architectures (wirebonding, embedded chip, and flip-chip) for high frequency and hig Master Idiomas TAREAS/TASKS: Design,...
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Advanced Packaging Of Gan-Based Hemts
hace 6 días
Madrid, Madrid, España Universidad Politécnica de Madrid Employees, Location, Alumni A tiempo completoPuesto: Advanced packaging of GaN-based HEMTs Función: Design, modelling, and fabrication of advanced packaging architectures for the System-in-Package (SiP) integration of GaN-based HEMTs: Optimization of various packaging architectures (wirebonding, embedded chip, and flip-chip) for high frequency and hig Master Idiomas TAREAS/TASKS:Design, modelling, and...
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Advanced Packaging Of Gan-Based Hemts
hace 6 días
Madrid, Madrid, España Universidad Politécnica de Madrid Employees, Location, Alumni A tiempo completoPuesto: Advanced packaging of GaN-based HEMTs Función: Design, modelling, and fabrication of advanced packaging architectures for the System-in-Package (SiP) integration of GaN-based HEMTs: Optimization of various packaging architectures (wirebonding, embedded chip, and flip-chip) for high frequency and higMasterIdiomasTAREAS/TASKS:Design, modelling, and...
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Advanced Packaging of Gan-based Hemts
hace 2 meses
Madrid, España UNIVERSIDAD POLITÉCNICA DE MADRID A tiempo completoFunción: Design, modelling, and fabrication of advanced packaging architectures for the System-in-Package (SiP) integration of GaN-based HEMTs: Optimization of various packaging architectures (wirebonding, embedded chip, and flip-chip) for high frequency and hig - Empresa: UNIVERSIDAD POLITÉCNICA DE MADRID - Nº de Plazas: 1 - Referencia: HRS2024/186 -...
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Advanced Packaging Of Gan-Based Hemts
hace 5 horas
Madrid, España Universidad Politécnica De Madrid A tiempo completoFunción: Design, modelling, and fabrication of advanced packaging architectures for the System-in-Package (SiP) integration of GaN-based HEMTs: Optimization of various packaging architectures (wirebonding, embedded chip, and flip-chip) for high frequency and hig- Empresa: UNIVERSIDAD POLITÉCNICA DE MADRID- Nº de Plazas: 1- Referencia: HRS2024/186-...
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High-Performance Gan-Based Hemts
hace 4 semanas
Madrid, España Universidad Politécnica de Madrid Employees, Location, Alumni A tiempo completoPuesto: High-performance GaN-based HEMTs Función: Design, modelling, and fabrication of high-performance GaN-based HEMTs: Development of nanocale devices by E-Beam Lithography (EBL) and Thermal Scanning Probe Lithography (t-SPL) in normally-on and normally-off HEMT structures... Master Idiomas TAREAS/TASKS: Design, modelling, and fabrication of...
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High-Performance Gan-Based Hemts
hace 3 semanas
Madrid, España Universidad Politécnica de Madrid Employees, Location, Alumni A tiempo completoPuesto: High-performance GaN-based HEMTs Función: Design, modelling, and fabrication of high-performance GaN-based HEMTs: Development of nanocale devices by E-Beam Lithography (EBL) and Thermal Scanning Probe Lithography (t-SPL) in normally-on and normally-off HEMT structures... Master Idiomas TAREAS/TASKS: Design, modelling, and fabrication of...
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High-Performance Gan-Based Hemts
hace 6 horas
Madrid, España Universidad Politécnica de Madrid Employees, Location, Alumni A tiempo completoPuesto: High-performance GaN-based HEMTs Función: Design, modelling, and fabrication of high-performance GaN-based HEMTs: Development of nanocale devices by E-Beam Lithography (EBL) and Thermal Scanning Probe Lithography (t-SPL) in normally-on and normally-off HEMT structures... Master Idiomas TAREAS/TASKS: Design, modelling, and fabrication of...
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High-Performance Gan-Based Hemts
hace 6 días
Madrid, Madrid, España Universidad Politécnica de Madrid Employees, Location, Alumni A tiempo completoPuesto: High-performance GaN-based HEMTs Función: Design, modelling, and fabrication of high-performance GaN-based HEMTs: Development of nanocale devices by E-Beam Lithography (EBL) and Thermal Scanning Probe Lithography (t-SPL) in normally-on and normally-off HEMT structuresMaster Idiomas TAREAS/TASKS:Design, modelling, and fabrication of high-performance...
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High-Performance Gan-Based Hemts
hace 2 semanas
Madrid, España Universidad Politécnica de Madrid Employees, Location, Alumni A tiempo completoPuesto: High-performance GaN-based HEMTs Función: Design, modelling, and fabrication of high-performance GaN-based HEMTs: Development of nanocale devices by E-Beam Lithography (EBL) and Thermal Scanning Probe Lithography (t-SPL) in normally-on and normally-off HEMT structures...MasterIdiomasTAREAS/TASKS:Design, modelling, and fabrication of high-performance...
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High-Performance Gan-Based Hemts
hace 6 días
Madrid, Madrid, España Universidad Politécnica de Madrid Employees, Location, Alumni A tiempo completoPuesto: High-performance GaN-based HEMTs Función: Design, modelling, and fabrication of high-performance GaN-based HEMTs: Development of nanocale devices by E-Beam Lithography (EBL) and Thermal Scanning Probe Lithography (t-SPL) in normally-on and normally-off HEMT structuresMasterIdiomasTAREAS/TASKS:Design, modelling, and fabrication of high-performance...
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High-Performance Gan-Based Hemts
hace 5 horas
Madrid, España Universidad Politécnica De Madrid A tiempo completoFunción: Design, modelling, and fabrication of high-performance GaN-based HEMTs: Development of nanocale devices by E-Beam Lithography (EBL) and Thermal Scanning Probe Lithography (t-SPL) in normally-on and normally-off HEMT structures...- Empresa: UNIVERSIDAD POLITÉCNICA DE MADRID- Nº de Plazas: 1- Referencia: HRS2024/184- Publicada el 6/5/2024-...
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High-performance Gan-based Hemts
hace 2 meses
Madrid, España UNIVERSIDAD POLITÉCNICA DE MADRID A tiempo completoFunción: Design, modelling, and fabrication of high-performance GaN-based HEMTs: Development of nanocale devices by E-Beam Lithography (EBL) and Thermal Scanning Probe Lithography (t-SPL) in normally-on and normally-off HEMT structures... - Empresa: UNIVERSIDAD POLITÉCNICA DE MADRID - Nº de Plazas: 1 - Referencia: HRS2024/184 - Publicada el 6/5/2024 -...
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Hemt Integration with 2d Materials
hace 3 semanas
Madrid, España UNIVERSIDAD POLITÉCNICA DE MADRID A tiempo completoFunción: Integration of 2D materials with GaN-based high-electron mobility transistors (HEMTs) for advanced ICTs - Empresa: UNIVERSIDAD POLITÉCNICA DE MADRID - Nº de Plazas: 1 - Referencia: HRS2024/154 - Publicada el 8/4/2024 - Publicada hasta el 19/04/2024 - Tipo de Contrato: Contrato temporal - Dedicación: Jornada completa - Remuneración Bruta...
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Hemt Integration with 2d Materials
hace 3 semanas
Madrid, España UNIVERSIDAD POLITÉCNICA DE MADRID A tiempo completoFunción: Integration of 2D materials with GaN-based high-electron mobility transistors (HEMTs) for advanced ICTs - Empresa: UNIVERSIDAD POLITÉCNICA DE MADRID - Nº de Plazas: 1 - Referencia: HRS2024/154 - Publicada el 8/4/2024 - Publicada hasta el 19/04/2024 - Tipo de Contrato: Contrato temporal - Dedicación: Jornada completa - Remuneración Bruta...
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Senior Packaging Manager
hace 3 semanas
Madrid, España Microtech Global Limited A tiempo completoSenior Packaging ManagerSpain, ValenciaResponsibilities:• Improvement and development of manufacturing plans for photonic and electronic circuits and their system integration.• Supporting technology strategy and road mapping for future leading-edge packages and packaging solutions.• Providing program, project, and team management on high-tech R&D...
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Packaging Coordinator
hace 2 semanas
Madrid, España Volta Trucks A tiempo completoVolta Trucks, a hypergrowth European Electric Truck Manufacturer, is looking for a **Packaging Coordinator** to join our rapidly growing supply chain team. The role will be based in Spain and can be remote but with frequent travel to our manufacturing partners facility in Austria, Steyr. **What you will do**: Reporting into Packaging Engineering Manager, as...
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Automatic Packaging Technician
hace 7 días
Madrid, España ALK-Abelló A tiempo completoW **e are looking for a Automatic Packaging Technician** ALK's aspiration is to become the world leader in allergy by helping as many people with allergy to a better life by providing options of prevention, diagnosis and treatment of allergy. **Functional Area: Production** **Competences**: - Education: Bachelor degree in pharmacy, biology, chemistry or...
