Pics@Icfo Strategic Initiative: Research Engineer In Materials Structuring And Characterization Of Photonic Integrated Circuits

ICFO
- The Institute of Photonic Sciences Organisation/Company ICFO
- The Institute of Photonic Sciences Research Field Engineering » Electrical engineering Researcher Profile Recognised Researcher (R2) Positions Research Support Positions Application Deadline 29 Oct ***:00 (Europe/Madrid) Country Spain Type of Contract Temporary Job Status Full-time Offer Starting Date 16 Oct *
* Is the job funded through the EU Research Framework Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? PIC Nano-structuring and Nano-characterization Research Engineer with a strong technical background in materials research, characterization of morphology and interfaces, failure analysis, and photonic integrated circuits characterization.

We offer
a research engineer position to an experienced engineer with demonstrated expertise in integrated photonics and material research, especially characterization of PICs and their related materials. The successful candidate will contribute to both technical innovation and Pilot Line development in collaboration with academic and industrial stakeholders. Contribute to characterization and application-oriented activities of PIXEurope Pilot Line and other projects related to PICs. Interface with multidisciplinary teams and contribute to the establishment of high-quality characterization workflows. Nanocharacterization lab , In particular, it is co-funded by Spain through the Ministry for Digital Transformation and Civil Service under reference CJU-****, as part of the Recovery, Transformation and Resilience Plan (PRTR). Applicants must hold an engineer degree or a master degree Science or Engineering, preferably in fields related to nanoscience and nanotechnology, photonics, materials science, or electrical engineering. Fabrication and characterization of devices made of materials used in PICs, such as semiconductors, 2D materials, colloidal quantum dots, or thin films. Defect and failure analysis ranging from material structure to PIC devices. Materials research and chemical analysis of materials Nanofabrication techniques such as photoresist deposition, Electron beam lithography, optical lithography, Reactive Ion Etching, thin film deposition, Atomic Layer deposition, Chemical Vapour Deposition) Scanning Electron Microscope (SEM) and Focused Ion Beam to perform CD metrology, to realize some cross-sections and later observe the different transitions and interfaces of layers with integrated SEM, preparation of TEM lamellas. Atomic Force Microscopy, especially applied to large wafers for automatic detection of CDs, line edge, surface and sidewall roughness, and electrical characterization Transmission Electron Microscope (TEM) to characterize interfaces and map atomic elements by Energy Dispersive Microscopy. Proven track record in industry-oriented research, ideally involving joint R&D&E projects with end-users. Languages ENGLISH Level Excellent Research Field Engineering » Electrical engineering Fixed-term contract linked to funds (406)NextGeneration An engineer position within a leading-edge European research initiative, contributing to technological development with global impact. A dynamic work environment at the interface of fundamental research and industrial innovation, with opportunities for leadership and visibility.