Pics@Icfo Strategic Initiative: Research Engineer In Materials Structuring And Characterization Of Photonic Integrated Circuits

ICFO - The Institute of Photonic Sciences
Organisation/Company ICFO - The Institute of Photonic Sciences Research Field Engineering » Electrical engineering Researcher Profile Recognised Researcher (R2) Positions Research Support Positions Application Deadline 29 Oct ***:00 (Europe/Madrid) Country Spain Type of Contract Temporary Job Status Full-time Offer Starting Date 16 Oct Is the job funded through the EU Research Framework Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No
Offer Description
As part of the
PICs@ICFO Strategic Initiative
, ICFO coordinates
PIXEurope, a flagship Pilot Line funded under the European Chips JU program
focused on Advanced Photonic Integrated Circuits (PICs) through which ICFO is advancing frontier technologies, including optical interposers for Co-packaged optics for next-generation optoelectronic and photonic devices.
To strengthen this initiative, ICFO is seeking
PIC Nano-structuring and Nano-characterization Research Engineer
with a strong technical background in materials research, characterization of morphology and interfaces, failure analysis, and photonic integrated circuits characterization.
Position Overview:
We offer a research engineer position to an experienced engineer with demonstrated expertise in integrated photonics and material research, especially characterization of PICs and their related materials. The successful candidate will contribute to both technical innovation and Pilot Line development in collaboration with academic and industrial stakeholders.
Key Responsibilities:
The selected candidate will be expected to:
Set-up, run and consolidate some nanofabrication techniques for PIC development within the PIXEurope Pilot Line.
Set-up, run and consolidate the characterization techniques for PIC development within the PIXEurope Pilot Line.
Contribute to characterization and application-oriented activities of PIXEurope Pilot Line and other projects related to PICs.
Interface with multidisciplinary teams and contribute to the establishment of high-quality characterization workflows.
This position is hosted by the
Optoelectronics group
, led by
Prof Valerio Pruneri
, and the
Nanocharacterization lab
, led by
Dr. Johann Osmond.
PIXEurope is co-funded by the Chips Joint Undertaking and national funding authorities of the Participating States, Spain, Ireland, The Netherlands, Finland, Belgium, Portugal, Poland, Austria, France, Italy, United Kingdom. In particular, it is co-funded by Spain through the Ministry for Digital Transformation and Civil Service under reference CJU-******, as part of the Recovery, Transformation and Resilience Plan (PRTR).
Applicants must hold an engineer degree or a master degree Science or Engineering, preferably in fields related to nanoscience and nanotechnology, photonics, materials science, or electrical engineering.
Candidates should demonstrate strong expertise in the following areas:
Fabrication and characterization of devices made of materials used in PICs, such as semiconductors, 2D materials, colloidal quantum dots, or thin films.
Metrology characterization in a 200 mm diameter wafer capabilities environment
Characterization of defects and their automatic detection in the different processes of nanofabrication.
Defect and failure analysis ranging from material structure to PIC devices.
Metrology and nanoscale characterization of PICs.
Materials research and chemical analysis of materials
Expertise, or at least exposure, in the following technique will be evaluated:
Nanofabrication techniques such as photoresist deposition, Electron beam lithography, optical lithography, Reactive Ion Etching, thin film deposition, Atomic Layer deposition, Chemical Vapour Deposition)
Scanning Electron Microscope (SEM) and Focused Ion Beam to perform CD metrology, to realize some cross-sections and later observe the different transitions and interfaces of layers with integrated SEM, preparation of TEM lamellas.
Atomic Force Microscopy, especially applied to large wafers for automatic detection of CDs, line edge, surface and sidewall roughness, and electrical characterization
Transmission Electron Microscope (TEM) to characterize interfaces and map atomic elements by Energy Dispersive Microscopy.
Raman spectroscopy for material characterization.
Nano-infrared characterization using Scanning Probe Microscopy to provide chemical information in the infrared range at nanoscale dimension.
Desired (but not required) skills:
Proven track record in industry-oriented research, ideally involving joint R&D&E projects with end-users.
Languages ENGLISH Level Excellent
Research Field Engineering » Electrical engineering
Additional Information
What We Offer
Fixed-term contract linke