Junior Photonic Packaging Engineer

Hace 21 horas

Castelldefels, Cataluña, España BIST People Working Group Jornada completa 32.000 € - 42.000 €/año

ICFO is seeking a Junior Process Engineer in PIC Packaging to support the development of assembly and interconnect technologies for Photonic Integrated Circuits (PICs). The selected candidate will work in an advanced R&D pilot-line environment, developing processes and solving engineering challenges.

You will collaborate with multidisciplinary teams to implement scalable packaging solutions and advance PIC technologies from design to testing and applications.