Junior Photonic Packaging Engineer
Hace 2 días
Castelldefels, Cataluña, España
BIST People Working Group
Jornada completa
32.000 € - 42.000 €/año
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ICFO is seeking a Junior Process Engineer in PIC Packaging to support the development of assembly and interconnect technologies for Photonic Integrated Circuits (PICs). The selected candidate will work in an advanced R&D pilot-line environment, developing processes and solving engineering challenges.
You will collaborate with multidisciplinary teams to implement scalable packaging solutions and advance PIC technologies from design to testing and applications.