Junior Pic Packaging Engineer
Hace 3 días
España
Institute Of Photonic Sciences
Jornada completa
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Institute of Photonic Sciences (ICFO) invites applications for a Junior Process Engineer in PIC Packaging within the PICs@ICFO Strategic Initiative.
The role supports development of assembly and interconnect technologies for Photonic Integrated Circuits (PICs) in an advanced R&D pilot-line environment.You will work hands-on with manufacturing equipment, develop processes, and solve practical engineering challenges while collaborating with optical, mechanical, RF, and test engineers to deliver#J-*-Ljbffr