Director of Field Applications Engineers; EU, UK, APAC

Hace 3 semanas

Barcelona, Cataluña, España Baya Systems Jornada completa
Overview Director, Field Applications Engineering (UK/EU/APAC) Role Overview: Lead and grow a world-class Field Applications Engineering (FAE) team across Europe and the Asia-Pacific region. You will drive the technical adoption, integration, and design-win pipeline for our next-generation fabric interconnect silicon IP. You will be responsible for both Pre AND Post sales support. Role Details
* Position: Senior Manager, Field Applications Engineering
*

Location:
Remote (Based in the EU or the UK)
* Region Coverage: UK, Europe (EU) and Asia-Pacific (APAC)
* Travel: Up to 30-40% international travel required

Key Responsibilities
* Manage: Lead a distributed team of senior FAEs across EU and APAC.
* Hire: Recruit and onboard top-tier engineering talent in key regional hubs.
* Coach: Provide continuous technical mentorship and professional development.
* Align: Set clear regional goals aligned with corporate business objectives.
* Grow collaterals, to enable improved efficiency / ease of adoption by the customer Technical Account Management & Sales Support
* Drive Strategy: Partner with regional sales directors to secure high-value design wins.
* Own Delivery: Act as the escalations point for critical customer technical issues.
* Guide Evaluation: Oversee customer proof-of-concepts, evaluations, and architectural reviews.
* Present: Deliver technical keynotes, deep-dives, and product demonstrations to C-level executives.
* Feedback Loop: Funnel regional customer requirements directly to internal R&D and Product Management.
* Influence Roadmap: Use market insights to shape the future fabric interconnect IP roadmap.
* Enablement: Create application notes, whitepapers, and training collateral for regional ecosystems. Required Qualifications Experience & Education
*

Education:
Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related STEM field.
* Management: 5+ years of experience managing customer-facing engineering teams (FAE or Technical Support).
* Industry: 10+ years in the semiconductor, silicon IP, or high-performance networking sectors. Technical Expertise
* IP Knowledge: Deep understanding of Network-on-Chip (NoC), AMBA protocols (CHI, AXI, ACE), or PCIe/CXL fabrics.
* Design Flow: Familiarity with front-end ASIC design, SoC architecture, RTL verification, and EDA tools (Synopsys, Cadence, Siemens).
* Systems: Insight into AI/ML accelerators, data center architectures, and automotive SoC requirements. Soft Skills & Logistics
* Communication: Exceptional English verbal and written communication skills.
* Cross-Cultural: Proven experience managing teams and clients across diverse cultures in Europe and Asia.
* Autonomy: Self-motivated style suited for a fast-paced, early-stage startup environment. Preferred Qualifications
* Master’s degree or PhD in Electrical or Computer Engineering.
* Prior experience working in a fast-growing, venture-backed silicon IP startup.
* Existing technical relationships with major Tier-1 semiconductor and system companies in the EU and APAC.
* Additional language skills relevant to the covered regions (e.g., Mandarin, Japanese, Korean, German). #J-18808-Ljbffr