Junior Process Engineer in PIC Packaging

As part of the PICs@ICFO Strategic Initiative, ICFO is currently coordinating the European Chips JU Pilot Line PIXEurope and the Catalan PhotonChip project, both major initiatives aimed at advancing Photonic Integrated Circuits (PICs) in Europe. These projects strengthen ICFO’s strategic positioning across the entire PIC development pipeline — from design and fabrication to packaging, testing, and real-world applications. Position Overview We are seeking a Junior Process Engineer in PIC Packaging, to support the development of assembly and interconnect technologies for Photonic Integrated Circuits (PICs). The selected candidate will play a key role in the experimental development of advanced PIC technologies within the PICs@ICFO Strategic Initiative. This is a highly hands-on position in an advanced R&D pilot-line environment, ideally suited for candidates who enjoy working with manufacturing equipment, developing processes, and solving practical engineering challenges. We welcome applications from motivated candidates eager to learn and grow in the field of photonics packaging.

Key Responsibilities
The successful candidate will be actively involved in operating and programming assembly equipment, developing manufacturing processes, and troubleshooting technical challenges in an advanced R&D pilot-line environment. Specifically:
• Develop and optimize die assembly and interconnection processes for electronic and photonic devices, including die attach, solder reflow, wire bonding, solder bumping and other related packaging processes.
• Set up, program, and operate semi-automated equipment for process development and prototyping.
• Support the selection and qualification of materials, components, and suppliers to ensure process compatibility and quality.
• Optimize packaging processes through experimental evaluation, including thermo-mechanical integrity and reliability testing (e.g., die shear, wire pull, thermal cycling).
• Collaborate closely with multidisciplinary teams including optical, mechanical, RF, and test engineers to implement scalable and manufacturable packaging solutions. This position will report to the Prof. Dr. Valerio Pruneri, Scientific Coordinator of the PICs@ICFO Strategic Initiative encompassing the European Chips JU Pilot Line PIXEurope and the Catalan PhotonChip project. Eligibility and Conditions Applicants must hold FP Grado Superior, Bachelor’s, or Master’s Degree in Electronics, Microelectronics Engineering, Photonics, or a related field. We are looking for candidates with a proven track record in the following:
• demonstrated experience working with precision equipment and instrumentation, in academics, R&D or industrial environment.
• familiarity with semiconductor processes and environment is a plus The ideal candidate is pragmatic and detail-oriented, collaborative and motivated to work in a multidisciplinary environment bridging research and industrial applications.

What We Offer
• Full-time contract for scientific and technical activities pursuant to Spanish Law 14/2011, linked to the Catalan PhotonChip project.
• Access to state-of-the-art facilities for Photonic Packaging and Testing.
• Opportunity to develop hands-on expertise in advanced packaging technologies at the interface between academia and industry.
• A family allowance may be granted to candidates with dependents, in accordance with ICFO policies. Equal Opportunity ICFO is an equal opportunity employer. We hire based solely on merit and potential, regardless of gender, nationality, or disability. ICFO fully endorses the European Charter for Researchers and Code of Conduct for the Recruitment of Researchers, ensuring a transparent and supportive recruitment process. Application procedure To apply, please submit your:
• resume,
• a cover letter outlining your experience,
• contact information for 2 professional references. Applications should be submitted via the ICFOjobs platform http://jobs.icfo.eu. The selection process is conducted in accordance with ICFO’s Open, Transparent and Merit-based Recruitment (OTM-R) Policy, ensuring equal opportunities, transparency, and fair treatment for all applicants. Candidates are assessed exclusively on the basis of their qualifications, experience, skills, achievements, and potential in relation to the requirements of the position. Further information on the recruitment principles and procedures, conflict of interest and the appeals mechanism available to candidates, can be found in the OTM-R Policy. The selection process will consist of: 1. Eligibility check of applications 2. Assessment of merits (education, experience, and language) 3. Interview with shortlisted candidates The Evaluation Committee will include at least three members and ensure gender balance and impartiality. Each phase will be documented, and candidates will be notified of the outcome within 15 days of the interview. For formal enquiries regarding the application process, please contact: jobs@icfo.eu For project and technology enquiries, please contact: valerio.pruneri@icfo.eu For more information about ICFO, visit: https://www.icfo.eu Data Protection In accordance with Regulation (EU) 2016/679 (GDPR) and Organic Law 3/2018, ICFO informs applicants that their personal data will be processed exclusively for recruitment purposes.
• Controller: Fundació ICFO – Institut de Ciències Fotòniques, Av. Carl Friedrich Gauss 3, 08860 Castelldefels (Barcelona)
• DPO: dpo@icfo.eu
• Legal basis: performance of a task in the public interest.
• Rights: access, rectification, erasure, restriction, and opposition.
• Supervisory authority: Catalan Data Protection Authority (APDCAT) https://apdcat.gencat.cat. All recruitment files will be retained in accordance with the Catalan public-sector archival retention schedule (DOGC 2117). Reference: 1148 Application deadline: 30/10/2026 Aquest contracte està cofinançat amb el Fons Europeu de Desenvolupament Regional (FEDER) de la Unió Europea, en el marc del Programa del FEDER de Catalunya 2021
- 2027.