Senior Thermal Engineer

Hace 21 horas

Barcelona, Catalonia, España Hireroo Jornada completa


Job Description
Our partner is looking for a Senior Thermal Engineer to own the thermal architecture for advanced compute hardware, from die and package level analysis through liquid cooling, sled design and rack level heat rejection. This is a senior individual contributor role with strong technical ownership. You will define thermal budgets, cooling requirements and validation methods, working closely with mechanical, power and hardware teams.

Location:
Barcelona, Spain, Hybrid Level: Senior Responsibilities
• Own thermal design from silicon to rack level
• Define thermal budgets for high power compute hardware
• Model die hotspots, package spreading and board level thermal behaviour
• Run CFD and conjugate heat transfer simulations
• Perform transient analysis using realistic workload power profiles
• Design cold plates, manifolds and liquid cooling loops
• Define flow rate, pressure drop and coolant requirements
• Specify TIM stack, bond line and thermal interface requirements
• Define sled and rack thermal architecture
• Set coolant distribution, redundancy and failure response requirements
• Own thermal validation on real hardware
• Correlate simulation results with sensor and test measurements
• Work with mechanical, power and cooling partners
• Support thermal telemetry, throttling and power management decisions Requirements
• 8+ years of electronics thermal engineering experience
• Background in high power computing, data centres or similar electronics
• Thermal ownership of processors, GPUs, ASICs or FPGAs
• Strong package level thermal analysis
• Strong CFD and thermal simulation experience
• Icepak, Flotherm, Star CCM+ or equivalent
• Liquid cooling and cold plate design
• Flow and pressure budget experience
• TIM selection and bond line knowledge
• Thermal interface reliability understanding
• Practical thermal validation experience
• Strong simulation to measurement correlation skills Optional / Desired
• 2.5D, interposer or chiplet thermal design
• Two phase cooling
• Immersion cooling
• Direct to chip cooling
• OCP rack cooling experience
• Facility water interface design
• Electro thermal simulation
• Power delivery or PDN collaboration
• Python for automation and test analysis What’s in it for you?
• Flexible

working hours
• Hybrid model, 4 days office, 1 day from home
• 1 week per year working from anywhere
• 25 days annual leave plus December 24 and 31
• Monthly food allowance
• Private medical insurance
• Relocation bonus
• Housing search support
• Visa support if required
• Family relocation support
• Virtual shares
• Language classes
• Tax incentive, subject to eligibility