Junior Photonic Packaging Engineer
Hace 3 días
Castelldefels, Cataluña, España
BIST People Working Group
Jornada completa
Gratis con email o Google
Guarda esta oferta y sigue tu búsqueda
Crea una cuenta gratis para guardar empleos, crear alertas y volver a esta oferta desde tu panel.
Gratis con email o Google
Al continuar, aceptas nuestros Términos & Política de Privacidad.
ICFO is seeking a Junior Process Engineer in PIC Packaging to support the development of assembly and interconnect technologies for Photonic Integrated Circuits (PICs). The selected candidate will work in an advanced R&D pilot-line environment, developing processes and solving engineering challenges.
You will collaborate with multidisciplinary teams to implement scalable packaging solutions and advance PIC technologies from design to testing and applications.
You will collaborate with multidisciplinary teams to implement scalable packaging solutions and advance PIC technologies from design to testing and applications.