Junior Photonic Packaging Engineer

Hace 3 días

Castelldefels, Cataluña, España BIST People Working Group Jornada completa
ICFO is seeking a Junior Process Engineer in PIC Packaging to support the development of assembly and interconnect technologies for Photonic Integrated Circuits (PICs). The selected candidate will work in an advanced R&D pilot-line environment, developing processes and solving engineering challenges.
You will collaborate with multidisciplinary teams to implement scalable packaging solutions and advance PIC technologies from design to testing and applications.