Senior Thermal Engineer
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Our partner is looking for a Senior Thermal Engineer to own the thermal architecture for advanced compute hardware, from die and package level analysis through liquid cooling, sled design and rack level heat rejection.
This is a senior individual contributor role with strong technical ownership. You will define thermal budgets, cooling requirements and validation methods, working closely with mechanical, power and hardware teams.
Location: Barcelona, Spain, Hybrid
Level: Senior
Responsibilities
- Own thermal design from silicon to rack level
- Define thermal budgets for high power compute hardware
- Model die hotspots, package spreading and board level thermal behaviour
- Run CFD and conjugate heat transfer simulations
- Perform transient analysis using realistic workload power profiles
- Design cold plates, manifolds and liquid cooling loops
- Define flow rate, pressure drop and coolant requirements
- Specify TIM stack, bond line and thermal interface requirements
- Define sled and rack thermal architecture
- Set coolant distribution, redundancy and failure response requirements
- Own thermal validation on real hardware
- Correlate simulation results with sensor and test measurements
- Work with mechanical, power and cooling partners
- Support thermal telemetry, throttling and power management decisions
Requirements
- 8+ years of electronics thermal engineering experience
- Background in high power computing, data centres or similar electronics
- Thermal ownership of processors, GPUs, ASICs or FPGAs
- Strong package level thermal analysis
- Strong CFD and thermal simulation experience
- Icepak, Flotherm, Star CCM+ or equivalent
- Liquid cooling and cold plate design
- Flow and pressure budget experience
- TIM selection and bond line knowledge
- Thermal interface reliability understanding
- Practical thermal validation experience
- Strong simulation to measurement correlation skills
Optional / Desired
- 2.5D, interposer or chiplet thermal design
- Two phase cooling
- Immersion cooling
- xghoner Direct to chip cooling
- OCP rack cooling experience
- Facility water interface design
- Electro thermal simulation
- Power delivery or PDN collaboration
- Python for automation and test analysis
What’s in it for you?
- Flexible working hours
- Hybrid model, 4 days office, 1 day from home
- 1 week per year working from anywhere
- 25 days annual leave plus December 24 and 31
- Monthly food allowance
- Private medical insurance
- Relocation bonus
- Housing search support
- Visa support if required
- Family relocation support
- Virtual shares
- Language classes
- Tax incentive, subject to eligibility
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