Postdoc: TGV Metallization
Guarda esta oferta y sigue tu búsqueda
Crea una cuenta gratis para guardar empleos, crear alertas y volver a esta oferta desde tu panel.
Al continuar, aceptas nuestros Términos & Política de Privacidad.
ICFO invites applications for a postdoctoral researcher position within the PICs@ICFO Strategic Initiative focused on Through-Glass Vias metallization and seed-layer processes. The successful candidate will develop and optimize seed layers and deposition methods for high-aspect-ratio vias in glass to enable copper interconnects.
The role emphasizes hands-on thin-film deposition, surface activation, adhesion promotion, and integration with subsequent plating steps, in collaboration with the