Senior Staff Layout Engineer

hace 2 semanas

Valencia, España ams-OSRAM AG A tiempo completo

**Valencia,, Spain — ams-OSRAM AG**:Bringing intelligence to light and passion to innovation

The ams OSRAM Group is a global leader in optical solutions. By adding intelligence to light and passion to innovation, we enrich peoples' lives. This is what we mean by Sensing is Life. Our around 26,000 employees worldwide focus on innovation across sensing, illumination and visualization to make journeys safer, medical diagnoses more accurate and daily moments in communication a richer experience.
The Image Sensor Solutions business aims to become the uncontested leader in optical imaging solutions extending human vision. ISS products are mainly produced in Austria and Singapore.

Your new responsibilities
- Ensure ALLEGRO PCB Design according to specifications and Design rules
- Take responsibility for project effort estimations and project reviews related to PCB layout design
- Work with multi-functional team to understand system requirements and physical design limitations
- Drive co-optimization of physical design on Multi Layer Board (MLP), System in Package (SiP), package and silicon
- Provide implementation guidelines and feedback to silicon, package and system design groups
- Perform feasibility study, design verification and sign off
- Resolve PCB design issues with fabrication and manufacturing vendors

What we look for
- Experience in the physical design of multi-layer (MLBs) or system in package (SIP)
- Experience in schematic capture and system integration
- Technical degree or equivalent is necessary
- Strong physical understanding of power and signal integrity fundamentals
- Experience in the physical design of Power Delivery Networks (PDNs) and high-speed signals at PCB level
- Familiar with High Density Interconnect (HDI), PCB and Flip-Chip BGA package substrate technologies
- Strong experience in Cadence Allegro or SIP for physical design
- Ability to collaborate and work effectively with cross functional teams
- Excellent organization and planning skills, able to work on parallel tasks
- Base knowledge of Chip Layout or willing to learn Chip Layout
- Familiarity with analog and mixed signal structures
- Soft Skills: excellent communication in English and/or German, problem solving and team player

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