Pics@icfo Strategic Initiative: Researcher in Material and Morphological Characterization of Photonic Integrated Circuits
hace 12 horas
**Key Responsibilities**:
- Set-up, run and consolidate the characterization techniques for PIC materials and platforms, in particular morphological, chemical, structural and interface analysis, developed within the PIXEurope Pilot Line.
- Contribute to setting up and operate PIC characterization services within PIXEurope.
- Interface with multidisciplinary teams and contribute to the establishment of high-quality characterization workflows.
This position will report to **Prof. Dr. Valerio Pruneri, Director of the European Chips JU Pilot Line PIXEurope**, in collaboration with **Prof. Dr. Gerasimos Konstantatos, Head of the Nano Characterization Lab** where the related activities will be hosted.
This contract has received funding from the European Union’s Horizon Europe under the Grant Agreement # 101213727, Chips Joint Undertaking (Chips JU) and the Spanish Ministry for Digital Transformation and Civil Service, and is supported by funds from the Recovery, Transformation and Resilience Plan (PRTR).
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Applicants must hold a PhD degree in Science or Engineering, preferably in fields related to photonics, materials science, or electrical engineering.
- Materials research and chemical analysis of materials used in PICs, such as semiconductors, colloidal quantum dots, 2D materials, thin films,...
- Characterization of surfaces and interfaces such as semiconductor, organic thin films.
- Defect and failure analysis ranging from material structure to integrated circuits or PIC devices.
- Metrology and nanoscale characterization of PICs.
Expertise in the following technique will be evaluated:
- Time of Flight Secondary Ion Mass Spectroscopy to provide element analysis, allowing for multispectral chemical maps and chemical bonding at surfaces and in depth through sputter profiles.
- Nano-infrared characterization using Scanning Probe Microscopy to provide chemical information in the infrared range at nanoscale dimension.
- Atomic Force Microscopy, especially applied to large wafers for automatic detection of CDs, line edge, surface and sidewall roughness,
- Scanning Microwave Impendence Microscopy for capacitance mapping.
- Transmission Electron Microscope (TEM) to characterize interfaces and map atomic elements by Energy Dispersive Microscopy.
- Scanning Electron Microscope (SEM) and Focused Ion Beam to perform some cross-sections and later observe the different transitions and interfaces of layers with integrated SEM, preparation of TEM lamellas, and CD metrology.
- X-ray microscope for failure analysis.
Desired (but not required) skills:
- Proven track record in industry-oriented research, ideally involving joint R&D&E projects with end-users.
**What We Offer**
- Indefinite contract for scientific and technical activities pursuant to Spanish Law 14/2011, linked to the duration or availability of funds within the PIXEurope Pilot Line
- Access to cutting-edge facilities and a vibrant, interdisciplinary research environment.
- A presentation letter outlining your interest in the position.
- A curriculum vitae, including full contact information.
Applications will be reviewed as they are received.
19th of September, 2025
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